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中文摘要: 强度和导电性是金属材料两个至关重要的性能,但往往顾此失彼,不可兼得。本研究提出利用纳米尺寸孪晶实现金属强化,以期获得高强度和高导电性。实验采用脉冲电解沉积技术制备出具有高密度纳米尺寸孪晶的纯铜薄膜,其拉伸强度达1068MPa,是普通纯铜的10倍以上,并且室温电导率与无氧高导铜相当(97%IACS)。系统研究了孪晶片层厚度对样品性能的影响。
Abstract:Methods used to strengthen metals generally cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength of 1068 MPa, which is about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper(97%IACS). The effect of twin lamella thickness on the samples properties was studied systematically.
文章编号: 中图分类号:TB383 文献标志码:
基金项目:国家自然科学基金资助项目
Author Name | Affiliation |
Lu Ke | Shenyang National Laboratory for Materials Science,Institute of Metal Research,CAS,110016 Shenyang |
引用文本:
卢柯.纳米孪晶纯铜的强度和导电性研究[J].中国科学院院刊,2004,(5):352-354.
Lu Ke.A Study on Ultrahigh Strength and High Electrical Conductivity in Copper[J].Bulletin of Chinese Academy of Sciences,2004,(5):352-354.
卢柯.纳米孪晶纯铜的强度和导电性研究[J].中国科学院院刊,2004,(5):352-354.
Lu Ke.A Study on Ultrahigh Strength and High Electrical Conductivity in Copper[J].Bulletin of Chinese Academy of Sciences,2004,(5):352-354.