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修订日期:2025-05-08
修订日期:2025-05-08
中文摘要: 面向“十五五”,我国半导体装备产业面临技术封锁与供应链脱钩的双重挑战,需从“追赶替代”转向“路径创新”,突破对国际技术体系的依赖。文章分析了三大核心需求:支撑自立自强 (突破先进制程装备与零部件瓶颈)、构建中国特色创新生态(探索GAA、3D集成等新技术路径)、推动智能化升级(融合AI与数字化技术)。同时,提出以“再全球化”策略应对逆全球化,通过内循环与国际双循环协同,重塑全球半导体产业链。当前,国产装备在成熟制程取得突破,但高端领域仍被美国、日本、欧洲垄断,且面临低水平重复竞争、供应链“卡脖子”等问题。建议通过系统性科技攻关、上下游协同创新,避免内卷,聚焦非对称技术优势,实现从自主可控到自立自强的跨越。
Abstract:During the “15th Five-Year Plan”, China’s semiconductor equipment industry is facing the dual challenges of technological blockade and supply chain decoupling. It needs to shift from “catching up and replacing” to “path innovation” to break through its dependence on the international technology system. This study analyzes three core needs: supporting self-reliance (breaking through the bottleneck of advanced process equipment and parts), building an innovation ecosystem with Chinese characteristics (exploring new technology paths such as GAA and 3D integration), and promoting intelligent upgrading (integrating AI and digital technology). At the same time, it proposes to use the strategy of “re-globalization” to deal with counter-globalization, and reshape the global semiconductor industry chain through the synergy of the internal cycle and the international double cycle. At present, domestic equipment has made breakthroughs in mature processes, but the high-end field is still monopolized by the United States, Japan and Europe, and faces problems such as low-level repeated competition and “stuck necks” in the supply chain. It is recommended to avoid internal entanglements through systematic scientific and technological research and collaborative innovation between upstream and downstream, focus on asymmetric technological advantages, and realize the leap from autonomous and controllable to self-reliance and self-improvement.
keywords: semiconductor equipment integrated circuits path innovation re-globalization industrial ecology
文章编号: 中图分类号: 文献标志码:
基金项目:
作者 | 单位 |
叶甜春1* | 中国科学院微电子研究所 北京 100029 |
朱煜2 | 清华大学 北京 100084 |
张国铭3 | 集成电路装备创新联盟 天津 300350 |
杜晓黎4 | 集成电路设计创新联盟 北京 100015 |
雷震霖5 | 集成电路零部件创新联盟 沈阳 110179 |
苑朋朋1 | 中国科学院微电子研究所 北京 100029 |
引用文本:
叶甜春,朱煜,张国铭,杜晓黎,雷震霖,苑朋朋.面向“十五五”的半导体装备的挑战与机遇[J].中国科学院院刊,2025,40(5):844-851.
YE Tianchun,ZHU Yu,ZHANG Guoming,DU Xiaoli,LEI Zhenlin,YUAN Pengpeng.Challenges and opportunities for semiconductor equipment facing 15th Five-Year Plan[J].Bulletin of Chinese Academy of Sciences,2025,40(5):844-851.
叶甜春,朱煜,张国铭,杜晓黎,雷震霖,苑朋朋.面向“十五五”的半导体装备的挑战与机遇[J].中国科学院院刊,2025,40(5):844-851.
YE Tianchun,ZHU Yu,ZHANG Guoming,DU Xiaoli,LEI Zhenlin,YUAN Pengpeng.Challenges and opportunities for semiconductor equipment facing 15th Five-Year Plan[J].Bulletin of Chinese Academy of Sciences,2025,40(5):844-851.